Jagrut Brahmbhatt
Research Assistant | Design Engineer

About

I engineer systems where heat, structure, and flow converge. At Georgia Tech, my research centers on multiphysics modeling, Finite Element Analysis (FEA), and Computational Fluid Dynamics (CFD) for Jet Engines and advanced semiconductor packaging.

Previously at Larsen & Toubro, I designed ASME-certified reactors and pressure vessels — work that grounded my focus on design for manufacturability and reliability.

I now apply that foundation to micro-scale design, using simulation as a tool to build systems that perform predictably under real-world constraints.

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Expertise

Flip-Chip Reliability & Glass-Core Packaging

Thermo-Mechanical Reliability Design

Design for Manufacturability (DFM)

Heat Transfer & Cryogenics

Finite Element Analysis (FEA)

Computational Fluid Dynamics (CFD)

Multiphysics Simulation (ANSYS Fluent, Mechanical, ABAQUS)

Thermal–Structural Simulation

Mechanical Product Design (CAD/CAE)

Structural & Fatigue Analysis

Optimization & Numerical Methods

Python / MATLAB / C++

Machine Learning for Engineering Applications

Experience

Developed a finite element model for fretting fatigue in jet engine turbine blades using ANSYS and custom C++/Gmsh scripts; supported experimental validation through hands-on machining and specimen prep

Simulated capillary-driven microchannel heat exchangers using multiphase CFD and validated prototypes through lab-scale experiments, enhancing reliability in advanced electronic cooling systems.

Led ASME-compliant design and FEA of high-pressure vessels and reactor systems for global clients, optimizing structural integrity under pressure, seismic, thermal, and fatigue loads using ANSYS. Delivered major cost savings through DFM-driven redesigns and directed cross-functional teams from concept to client-approved fabrication packages.

Education

Focused on FEA, CFD, and microfabrication; contributed towards advanced research in thermomechanical analysis of jet engines, high density thermal-fluid systems and semiconductor packaging.

Graduated with distinction, conducted cryogenic heat transfer simulations that improved thermal performance of pulse tube cryocoolers.